| | Inclusive: Design Rule Check
Before production we analyze data (Gerber files) for
manufacturabilityand if they comply with production parameters. To
avoid scrap wecheck them for typical design errors as for example
unrouted connections,tights, or too narrow line distances and have
them corrected beforeproduction starts. Inclusive: AOI, automatic opticalinspection
We scan all PCBs and the inner layers of multilayer PCBs in an
automatedoptical test to find deviations in comparison to the
layout files.AOI will report opens and shorts, defects such as
almost shorts,almost opens, critical copper splashes, pinholes,
over or underetched tracks, blocked holes etc. | | Inclusive: X-Ray Inspection (misalignmentcontrol)
This inspection makes sure that PCB layers and drillholes are
correctlypositioned before laminating and drilling. Inclusive: Electrical testing
After manufacturing we perform a full continuity test checking
eachboard for shorts and opens (net list testing). For small
quantititieswe apply a flying probe test.
To ensure full functionality this test implies: | E-Test, technicaldata | | Max. test area | 500 x 700 mm | | No of test spots | 32800 | | Grid | 1/10 | | Insulation test voltage | 25-250 V
(Standard 100 V) | | Test current | max. 10 mA | | Circuit test | 1 Ohm - 2.5 kOhm | | Insulation test | 10 kOhm-100 MOhm |
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Optional: Controlled Impedance Testing, TDR test of panel coupons | |
With shorter signal transmission times and high clock ratesin
modern circuitry, the electrical properties of the tracescarrying
signals become more important. PCBs with controlledimpedance try to
avoid reflections and signal aberrations causedby the PCBs
configuration i.e. material characteristics anddimensions, trace
width and depth.
Prior to manufacturing we verify the board design and its
impedancerequirements. To make sure that the board matches the
specification(the value and tolerance of impedance), we integrate
test couponsinto the PCB panels and check with a TDR (time domain
reflectometer)if impedances are correct.
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